Process Integration Engineer (Long Term Contract) in Redmond

Job DescriptionJob Description

Process Integration Engineer (Long Term Contract)

Experience Required: 4–5 Years
Job Level: Mid-Level

Job Summary

We are seeking a hands-on Process Integration Engineer with 4–5 years of experience in semiconductor processing, electro-optics, nano-fabrication, or advanced manufacturing.

The ideal candidate will have experience developing, optimizing, and troubleshooting fabrication processes for electro-optical, photonic, and micro/nanoscale devices. This role involves hands-on cleanroom work, process development, device integration, testing, and improving manufacturing quality and performance.

Key Responsibilities

• Develop, optimize, and integrate fabrication processes for electro-optical, photonic, and semiconductor devices.
• Perform hands-on process development involving lithography, thin-film deposition, etching, and wafer processing.
• Support device fabrication, process integration, and testing.
• Troubleshoot fabrication defects, process variations, and manufacturing issues.
• Operate and support cleanroom and semiconductor processing equipment.
• Conduct process characterization, metrology, and quality inspections.
• Analyze process data to improve yield, reliability, and manufacturing efficiency.
• Develop process documentation, test procedures, and technical reports.
• Collaborate with engineering and manufacturing teams to support product development and process improvements.

Required Qualifications

• Bachelor's degree in Engineering, Materials Science, Physics, or a related technical field.
• 4–5 years of hands-on experience in process engineering, semiconductor fabrication, nano-fabrication, or process integration.
• Experience with lithography, deposition, etching, or wafer-level processing.
• Knowledge of semiconductor, electro-optical, or photonic device fabrication.
• Experience working in a cleanroom or advanced fabrication laboratory.
• Familiarity with process testing, metrology, and materials characterization.
• Strong troubleshooting, analytical, and problem-solving skills.
• Ability to work independently and collaborate with engineering teams.

Qualifications

• Experience with electro-optical devices, photonics, or optical sensors.
• Knowledge of photolithography, electron-beam lithography, or micro/nano-fabrication techniques.
• Experience with thin-film deposition (PVD, CVD, ALD) and etching (RIE, ICP).
• Familiarity with wafer bonding, device packaging, or semiconductor process integration.
• Experience with microscopy, SEM, profilometry, or other precision measurement tools.
• Knowledge of Design of Experiments (DOE), statistical process control (SPC), and yield improvement.
• Experience in research and development, prototype fabrication, or advanced manufacturing environments.