Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR44530 Principal Engineer, PDE Frontier Materials & Package Characterization
As a PDE Principal engineer of Frontier Materials & Package Characterization Engineering, you will be primarily responsible for defining, pathfinding and explore new materials for Micron future market segments in AI, Immersion cooled and cryogenic memory high-performance computing. This includes to improve packaging quality and reliability, working on frontier materials characterization methodology, benchmarking on new test methodologies, and materials reliability risk management. You will also be required to identify, diagnose, and resolve potential new failure mechanisms with respect of each new frontier materials introduced by applying failure analysis, and some mechanical characterization methodology. Additional responsibilities include enabling new Characterization lab CAPEX and benchmarking external lab capabilities benchmarking and material evaluation/optimization to assess risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization, and liaising with material suppliers to achieve quality, cost and risk management objectives.
Responsibilities
Responsible for pathfinding of new frontier materials used in future Micron market segments such as AI, IoT and high-performance computing used in Quantum computing, future immersion-cooled datacenter applications, electric flight/ hybrid flight, space explorations.
Be the overall leader in driving discussion with packaging material suppliers in meeting new Micron materials specification and research roadmaps
Own and establish overall frontier projects in materials characterization, resource allocation
Collaborate with industrial alliances such as IEEE EPS technical section, ITRI, IMEC on materials, package, and new testing methodologies
Lead in PDE technical seminar initiatives, executive summary for frontiers materials sharing and industrial collaborations
Liaise with Asia university professors (Taiwan, Singapore, Malaysia, and India) and industrial Consortia in US for invited distinguished speaker opportunities and technical seminar collaborations in cryogenic memory and heterogenous integration roadmaps
Plan out executive summary tracking and forecasting by quarters
Be the Point-of Contact pertaining to all aspects of assigned products/packages in relating to new materials development engineering
Develop strategies to drive frontiers materials roadmaps & initiatives
Requirements
PhD in Electronics/ Mechanical/ Chemistry/ Physics/ Materials/ Chemical Engineering
Highly motivated individuals with 8+ years of relevant working experience are encouraged to apply
Possesses technical and people management experience in package development is a plus
Familiar and well-versed in component level, board level packaging and/or materials characterization
Experience and familiar with industrial Consortia such as IEEE/ JEDEC/ SEMI Technical Conferences and Seminars
Preferably candidate/s with IEEE conference paper publication, patent filing and journal publication
Good understanding of package reliability testing and material science
A team player equipped with excellent interpersonal and communication skills.
Possess initiative and ability to work independently.