Principal Engineer, DRAM Process Integration Pathfinding

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR49762 Principal Engineer, DRAM Process Integration PathfindingAs a Principal Engineer, DRAM Process Integration Pathfinding within the Technology Development group at Micron, your primary responsibility will be to lead the efforts in developing a module for the next generation DRAM technology node. As the module owner, you will define the structural and electrical requirements for one or more modules and work with unit process areas and supporting teams, as well as other module owners, to integrate your module with the entire flow. Work with a multi-disciplinary team of engineers to assess new architecture, devices, technology, and materials to validate the technology direction for the next 5+ years!Role and Responsibilities:Derive construction specifications based on electrical, inline metrics, unit processes and design rules.Design, perform and analyze experiments vital to meet engineering goals based on structure to electrical correlations.Solve problems with a model-based approach and drive technical innovation through process improvements, patents and/or technical papers.Develop, maintain, and improve process modules including design rules and structural and electrical specifications for alternative flows.Optimize existing process flows and develop creative solutions to meet product requirements.Design and complete experiments and analyze results with statistical analysis software like JMP.Feedback results to product to improve yield.Extract, monitor, analyze, and react to inline, defect, param and probe data to fix yield issues, increase performance and reliability, add process margin, and reduce costs.Partner with Design, Product Engineering, Modeling, Yield Enhancement, Electrical and Physical Failure analysis teams, Defect Analysis, Param, and Quality teams to understand issues, targets, and priorities for development.Summarize complex problems, derive, explain actions taken to address them and drive team to complete.Define sub-milestones for the project within your module.Maintain and enforce the best possible communication between Process Integration, Process Development and the Pilot Fab.Ensure timely documentation of R&D activities in your module for transfer to Manufacturing.Education and Experience: or PhD (Electrical Engineering, Microelectronics, Physics, or Material Science) or or equivalent experience with 5 - 10 years industry exposure.Knowledge of semiconductor device physics and electrical characterization.Knowledge of material science and semiconductor process fundamentals.Proficient in data analysis through JMP, Python or other data engineering software.Interpersonal, oral, and written English & Japanese communications-skills.Preferred Experience:5 - 10 years industry experience in process integration or a role that interacts with process integration and has a strong understanding of process integration requirements.2 years' experience DRAM manufacturing fab and/or DRAM transfer team experience.Experience in front of line, middle of line, interconnect of DRAM modules.Device Physics, Electronics or Electrical Engineering background highly preferred.