Skip to main content

IC Package Thermal Mechanical Lead Engineer, Dojo

IC Package Thermal Mechanical Lead Engineer, Dojo

5 days ago Be among the first 25 applicants

Get AI-powered advice on this job and more exclusive features.

Pay found in job post

Retrieved from the description.

Base pay range

$120,000.00/yr - $264,000.00/yr

Dice is the leading career destination for tech experts at every stage of their careers. Our client, Tesla Motors, is seeking the following. Apply via Dice today!

Tesla's Dojo & Self-Driving Hardware team is looking for an IC Package Mechanical Engineer who will be responsible for mechanical simulation and materials characterization of advanced IC packaging for the next of Self-Driving Hardware and Dojo Super AI Computer. In this highly visible role, this engineer will work closely with IC package integration, layout, EE, SI/PI, and thermal/mechanical teams. You will also interface with material, substrate, memory, foundry and assembly house vendors. You will drive packaging architecture pathfinding, design for manufacturing and reliability, and product level qualification.A successful candidate will have a strong growth mindset and be versatile in a highly dynamic environment.

Responsibilities

Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability

Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package materials, solder joint reliability, stacked via etc.

Model and simulate manufacturing and assembly process for conventional and advance packaging process, die to substrate joint process, underfill flow and curing process, package to board SMT process

Conduct first-order packaging thermal and mold flow analysis to optimize structural design

Packaging materials characterization to support new packaging architecture and materials selection using TMA, DMA, nanoindentation, lap shear, DSC, TGA etc. and applying adequate material models to precisely describe physical behavior

Requirements

Degree or equivalent with 7+ year experience in IC packaging mechanical/material engineering or related fields or equivalent experience

Strong hands-on experience of major FEM tools(e.g., ANSYS, ABAQUS, etc.)

Deep understanding of packaging materials, mechanical characterization and qualification methodology

Knowledgeable of advanced packaging technology, e.g fan-out, SoC&HBM integration HPC packaging, 3D IC structural concept

Excellent engineering problem solving skills with strong physics and fundamentals

Nice to have programming experience using Matlab, Python and fundamental machine learning capability

Benefits

Compensation and Benefits

Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire:

Aetna PPO and HSA plans > 2 medical plan options with $0 payroll deduction

Family-building, fertility, adoption and surrogacy benefits

Dental (including orthodontic coverage) and vision plans, both have options with a $0 paycheck contribution

Company Paid (Health Savings Account) HSA Contribution when enrolled in the High Deductible Aetna medical plan with HSA

Healthcare and Dependent Care Flexible Spending Accounts (FSA)

401(k) with employer match, Employee Stock Purchase Plans, and other financial benefits

Company paid Basic Life, AD&D, short-term and long-term insurance

Employee Assistance Program

Sick and Vacation time (Flex time for salary positions), and Paid Holidays

Back-up childcare and parenting support resources

Voluntary benefits to include: critical illness, hospital indemnity, accident insurance, theft & legal services, and pet insurance

Weight Loss and Tobacco Cessation Programs

Tesla Babies program

Commuter benefits

Employee discounts and perks program

Expected Compensation

$120,000 - $264,000/annual salary + cash and stock awards + benefits

Pay offered may vary depending on multiple individualized factors, including market location, job-related knowledge, skills, and experience. The total compensation package for this position may also include other elements dependent on the position offered. Details of participation in these benefit plans will be provided if an employee receives an offer of employment.

Seniority level

Seniority level Mid-Senior level

Employment type

Employment type Full-time

Job function

Job function Management and Manufacturing

Industries Software Development

Referrals increase your chances of interviewing at Jobs via Dice by 2x

Palo Alto, CA $168,000 - $179,000 2 weeks ago

Mountain View, CA $128,000 - $188,000 2 weeks ago

South San Francisco, CA $85,000 - $100,000 2 months ago

Milpitas, CA $135,000 - $150,000 2 weeks ago

San Jose, CA $115,200 - $153,600 5 days ago

We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.

#J-18808-Ljbffr

IC Package Thermal Mechanical Lead Engineer, Dojo

United States
Full time

Published on 07/12/2025

Share this job now