Engineer Process

In your new role you will: Bachelor Degree/Diploma in Mechanical / Electronics/ Electronics Packaging Engineering or related field. 0-2 years of experience in IC or smartcard packaging. Strong knowledge and understanding in die attach or other process in IC Assembly process. Ability to troubleshoot production issue. You are best equipped for this task if you have: Experience in IC assembly process for die attach or flip chip process Perform design of experiments (DOE) to launch new products and optimize process yield Support operation running in term of process control to accomplish good delivery, quality and competitive cost Identify and implement cost saving initiatives related to packaging materials, Able to handle CAR, pFMEA, MSA, SPC Driving decarbonization and digitalization. Together. Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. for more information about Diversity & Inclusion at Infineon.