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Electro Mechanical Engineer in Springfield

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Job Description

  • 300 mm wafer handling design (edge‑grip, vacuum, kinematic support)
  • Precision chuck design & compliant mechanisms
  • FEA (ANSYS, Abaqus, COMSOL) — stress, modal, and contact analysis
  • Modeling warped/bowed wafers, thin‑plate mechanics
  • Cleanroom design principles – ISO Class 1, low‑particle mechanisms
  • Vacuum system design, leak‑tight sealing, He‑leak testing

Material selection for semiconductor tools:

  • PEEK, Vespel, PTFE, PPS
  • Alumina, Aluminum Nitride, Ti‑6Al‑4V
  • Hard anodize, DLC, TiN, Parylene coatings

Motion system design:

  • Linear motors, voice‑coil actuators, pneumatic micro‑actuators
  • Flexures, guides, cross‑roller bearings
  • Jerk‑limited (S‑curve) motion and soft‑landing control
  • Edge‑grip mechanism design with low clamping forces
  • Tolerance analysis, GD&T, DFMEA, DOE
  • Semiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644

Metrology & Testing Skills

  • Warp, bow, TTV measurement techniques
  • Particle measurement and contamination control
  • Vacuum integrity tests (helium mass spectrometer, pressure decay)
  • Wafer alignment and edge detection sensors (optical/capacitive)
  • Reliability testing for 24/7 fab duty

If you are interested in applying for this job please press the Apply Button and follow the application process. Energy Jobline wishes you the very best of luck in your next career move.

Electro Mechanical Engineer in Springfield

Springfield, MO
Full time

Published on 04/19/2026

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